MediaTek Dimensity 7000 chip revealed specifications, expected to compete with Qualcomm's Snapdragon 870

Only recently launched Dimensity 9000, but information that MediaTek is developing Dimensity 7000 chip has begun to leak. Today, leaker Digital Chat Station shared the key specifications of this new generation of chips.

Accordingly, the Dimensity 7000 chip is said to be manufactured on TSMC's 5 nm process, including four Cortex-A78 cores clocked at 2.75 GHz and four Cortex-A55 cores clocked at 2.0 GHz.

In terms of graphics, Dimensity 7000 is expected to go hand in hand with the Mali-G510 MC6. It is speculated that the Dimensity 7000 will compete with Qualcomm's Snapdragon 870. Recently, experts said that Dimensity 7000 will support 75 W fast charging.

The aforementioned rumored specifications indicate that the Dimensity 7000 will fall between the segment of the Dimensity 1200 and the Dimensity 9000. A recent Weibo post by Redmi CEO Lu Weibing suggested that Redmi could pioneer a smartphone launch. Using a Dimensity 7000 chip.

Dimensity 7000 is said to have started entering the testing phase, so it is likely that this new chip will be released in December 2021 or January 2022. As for smartphones using the Dimensity 7000 chip, it could be released in the first quarter of 2022.

What improvements do you expect the Dimensity 7000 chip to possess?